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DEVELOPMENTAL TECHNICAL DATASHEET
THERMALLY CONDUCTIVE DIE ATTACH ADHESIVE
DESCRIPTION ABLEBOND(R) 2815A die attach adhesive offers high thermal conductivity to minimize thermal resistance between the chip and substrate. This adhesive is FEATURES * Excellent thermal and electrical conductivity * Good dispensability and good fillet formation * Good performance on Ag/Cu leadframes * Low moisture absorption
ABLEBOND(R) 2815A
designed to provide improved workability for applications requiring high heat extraction from die.
Typical Uncured Properties Filler Type Viscosity @ 25C Thixotropic Index Work Life @ 25C Est Storage Life @ -40C Cure Process Data Weight Loss on Cure Recommended Cure Condition PHYSIOCHEMICAL PROPERTIES - Post Cure Ionics Chloride Sodium Potassium
ABLEBOND 2815A Silver 8000 cP 5.6 24 hours 1 year ABLEBOND 2815A 6.8%
Test Description
Test Method ATM-0018 ATM-0089 ATM-0087 ATM-0068 Test Method ATM-0031 Test Method ATM-0007 ATM-0044 ATM-0002 ATM-0058 ATM-0055
Brookfield CP51 @ 5 rpm Viscosity @ 0.5/Viscosity @ 5 rpm 25% increase in viscosity @ RT
Test Description 10 x 10 mm Si die on glass slide
30 min ramp RT to 200C + 30 min @ 200C in N2 oven ABLEBOND 2815A < 10 ppm < 10 ppm < 10 ppm 70 mhos/cm 3.5 63C 64 ppm/C 122 ppm/C Test Description Teflon flask, 5 gm sample/20-40 mesh, 50 gm DI water, 100C for 24 hours Conductometer pH meter TMA penetration mode TMA expansion mode
Water Extract Conductivity pH Glass Transition Temperature Coefficient of Thermal Expansion Below Tg Above Tg
Typical properties are not intended for use as specification limits. If you need to write a specification, ask for our Standard Release Specification. This is a developmental product that has been converted to high volume manufacturing and is being monitored for process stability. During this monitoring period, certain properties may be adjusted slightly.
09/03
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2815A
PHYSIOCHEMICAL PROPERTIES - Post Cure Dynamic Tensile Modulus @-65C @ 25C @ 150C @ 250C Moisture Absorption @ Saturation THERMAL/ELECTRICAL PROPERTIES - Post Cure Thermal Conductivity Volume Resistivity Bond Joint Resistance MECHANICAL PROPERTIES Post Cure Die Shear Strength @ 25C Die Shear Strength (kgf/die) vs. Temperature Chip Warpage @ 25C vs. Chip Size ABLEBOND 2815A Test Description Test Method
9900 MPa (1,400,000 psi) Dynamic mechanical thermal 5700 MPa (830,000 psi) analysis (DMTA) using <0.5mm thick 1800 MPa (260,000 psi) sample 1600 MPa (230,000 psi) 0.24% ABLEBOND 2815A 20 W/mK 0.00004 ohm-cm 0.0002ohms ABLEBOND 2815A 5.8 kgf/die @25C 12.3 @200C 4.0 Chip Size 7.6x7.6mm (300 x 300 mil) 12.7x12.7mm (500x500mil) Dynamic vapor sorption after 85C/ 85% RH exposure Test Description Laser Flash 4-point probe 200 x 200 mil Cu/Cu, 6.4 m bondline thickness Test Description 2 x 2mm (80 x 80 mil) Si die on Ag/Cu leadframe @250C 3.4 3 x 3 mm (120 x 120 mil) Si die on Ag/Cu leadframe 0.38mm (15mil) thick Si die on 0.2mm thick Ag/Cu LF
ATM-0112
ATM-0093 Test Method ATM-0116 ATM-0020 ATM-0032 Test Method ATM-0052 ATM-0052
Warpage 9.7 m 37.6 m
ATM-0059
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2815A
APPLICATION GUIDELINES SHIPMENT This Ablestik product is packed and shipped in dry ice at -80C. Inside every dry ice shipment of Ablestik's products is a small packet containing the ABLECUBE. This is a small blue cube which retains its shape at -40C. If the ABLECUBE is exposed to temperatures higher than -40C, the cube will melt. Please check the state of the ABLECUBE to ensure the integrity of the shipment. If the ABLECUBE has melted upon Receiving inspection, place the entire shipment in a -40C freezer and contact your Ablestik Customer Service or Sales Representative. UNPACKING Transfer the syringes from the dry ice to a -40C freezer without ANY delays. Freeze-thaw voids will form in the syringes if the syringes are repeatedly thawed and refrozen. STORAGE This Ablestik product must be stored at -40C. The shelf life of the material is only valid when the material has been stored at the specified storage condition. Incorrect storage conditions will degrade the performance of the material in both handling (e.g. dispensing or screen printing) and final cured properties. THAWING Allow the container to reach room temperature before use. After removing from the freezer, set the syringes to stand vertically while thawing. Refer to the Syringe Thaw Time chart for the thaw time recommendation. DO NOT open the container before contents reach ambient temperature. Any moisture that collects on the thawed container should be removed prior to opening the container. DO NOT re-freeze. Once thawed to room temperature, the adhesive should not be re-frozen. ADHESIVE APPLICATION Thawed adhesive should be immediately placed on dispense equipment for use. If the adhesive is transferred to a final dispensing reservoir, care must be exercised to avoid entrapment of contaminants and/or air into the adhesive. Adhesive must be completely used within the product's recommended work life of 24 hours. Apply enough adhesive to achieve a 25-50 m (1-2 mil) wet bondline thickness, dispensed with approximately 25% - 50% filleting on all sides of the die. Alternate dispense amounts may be used depending on the application requirements. Star or crossed shaped dispense patterns will yield fewer bondline voids than the matrix style of dispense pattern. Contact your Ablestik Technical Service Department for detailed recommendation on adhesive application, including dispensing. AVAILABILITY ABLEBOND(R) adhesives are packaged in syringes or jars per customer specification. Available package sizes range from 1cc to 30cc and 1 ounce to 1 pound. For details, refer to the Ablestik Standard Package Data Set or contact your Customer Service Representative.
20021 Susana Road, Rancho Dominguez, CA 90221 (310) 764-4600 Fax (310) 764-2545 Customer Service Fax (310) 764-1783
The information given and the recommendations made herein are believed to be accurate but no guarantee of their accuracy is made. In every case we recommend that purchasers before using any product conduct their own tests to determine whether the product is suitable for their particular purposes under their own operating conditions. No representative of ours has any authority to waive or change the foregoing provisions but, subject to such provisions, our engineers are available to assist purchasers in adapting our products to their needs. Nothing contained herein shall be construed to imply the nonexistence of any relevant patents or to constitute a permission, inducement or recommendation to practice any invention covered by any patent, without the authority from the owner of this patent. These materials are not designed or manufactured for implantation in the human body. Approval from FDA for such use as part of any product to be implanted in the human body has NOT been sought nor received. We also expect purchasers to use our products in accordance with the guiding principles of the American Chemistry Council's Responsible Care(R) program.
For a technical contact nearest you, visit www.ablestik.com
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